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High-precision measurement of the positional deviation of patterns on the wafer surface/backside.
The DSM8/200 Gen2 is a dual-sided positioning measurement device compatible with 2 to 8-inch wafers. It is equipped with a function to eliminate TIS (tool-induced errors), achieving high-precision measurements in dual-sided patterning substrates in fields such as MEMS, power devices, and optical devices.
Inspection measurement of a thousand holes possible in just a few seconds! Hole position inspection device.
"Hole AOI" inspects and measures the hole positions, hole diameters, and hole accuracy of substrates or films, as well as shrinkage and expansion rates. In addition, it is equipped with a high-performance image acquisition system, allowing for the inspection and measurement of a thousand holes within a few seconds. Furthermore, it achieves high precision of 5 micrometers, with the capability to inspect and measure up to one million holes per panel. We also offer "Hole AOI Express." 【Features】 ■ High-performance image acquisition system ■ Capable of inspecting and measuring a thousand holes within a few seconds ■ Capable of inspecting and measuring up to one million holes per panel *For more details, please refer to the PDF materials or feel free to contact us.
